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DATA SHEET
512M bits DDR SDRAM WTR (Wide Temperature Range)
EDD5116ADTA-5CLI-E (32M words x 16 bits, DDR400)
Description
The EDD5116AD is 512M bits Double Data Rate (DDR) SDRAM, organized as 8,388,608 words x 16 bits x 4 banks. Read and write operations are performed at the cross points of the CK and the /CK. This high-speed data transfer is realized by the 2 bits prefetch-pipelined architecture. Data strobe (DQS) both for read and write are available for high speed and reliable data bus design. By setting extended mode register, the on-chip Delay Locked Loop (DLL) can be set enable or disable. It is packaged in 66-pin plastic TSOP (II).
Pin Configurations
/xxx indicates active low signal.
66-pin Plastic TSOP(II) VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDDQ LDQS NC VDD NC LDM /WE /CAS /RAS /CS NC BA0 BA1 A10(AP) A0 A1 A2 A3 VDD
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Features
* Power supply: VDD, VDDQ = 2.6V 0.1V * Data rate: 400Mbps (max.) * Double Data Rate architecture; two data transfers per clock cycle * Bi-directional data strobe (DQS) is transmitted /received with data for capturing data at the receiver * Data inputs, outputs, and DM are synchronized with DQS * 4 internal banks for concurrent operation * DQS is edge aligned with data for READs; center aligned with data for WRITEs * Differential clock inputs (CK and /CK) * DLL aligns DQ and DQS transitions with CK transitions * Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS * Data mask (DM) for write data * Auto precharge option for each burst access * SSTL_2 compatible I/O * Programmable burst length (BL): 2, 4, 8 * Programmable /CAS latency (CL): 3 * Programmable output driver strength: normal/weak * Refresh cycles: 8192 refresh cycles/64ms 7.8s maximum average periodic refresh interval * 2 variations of refresh Auto refresh Self refresh * Ambient temperature range: -40 to +85C * TSOP package with lead free solder (Sn-Bi)
Document No. E0563E10 (Ver. 1.0) Date Published July 2004 (K) Japan URL: http://www.elpida.com
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 NC VSSQ UDQS NC VREF VSS UDM /CK CK CKE NC A12 A11 A9 A8 A7 A6 A5 A4 VSS
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This product became EOL in September, 2007.
Elpida Memory, Inc. 2004
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A0 to A12 BA0, BA1
DQ0 to DQ15
(Top view)
LDQS, UDQS /CS /RAS /CAS /WE LDM, UDM CK /CK CKE VREF VDD VSS VDDQ VSSQ NC
Address input Bank select address Data-input/output Input and output data strobe Chip select Row address strobe command Column address strobe command Write enable Input mask Clock input Differential clock input Clock enable Input reference voltage Power for internal circuit Ground for internal circuit Power for DQ circuit Ground for DQ circuit No connection
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Ordering Information
Part number Mask version Organization (words x bits) 32M x 16 Internal banks 4 Data rate Mbps (max.) 400 JEDEC speed bin (CL-tRCD-tRP) DDR400C (3-4-4) Package 66-pin Plastic TSOP (II)
EDD5116ADTA-5CLI-E D
Part Number
E D D 51 16 A D TA - 5C LI - E
Elpida Memory
Type D: Monolithic Device
Environment Code E: Lead Free Spec. Detail LI: WTR (-40 to 85C) & Low Power
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Product Code D: DDR SDRAM
Density / Bank 51: 512M / 4-bank Bit Organization 16: x16
Speed 5C: DDR400C (3-4-4) Package TA: TSOP (II) Die Rev.
Voltage, Interface A: 2.5V, SSTL_2
Data Sheet E0563E10 (Ver. 1.0)
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EDD5116ADTA-5CLI-E
CONTENTS Description.....................................................................................................................................................1 Features.........................................................................................................................................................1 Pin Configurations .........................................................................................................................................1 Ordering Information......................................................................................................................................2 Part Number ..................................................................................................................................................2 Electrical Specifications.................................................................................................................................4 Block Diagram .............................................................................................................................................10 Pin Function.................................................................................................................................................11 Command Operation ...................................................................................................................................13 Simplified State Diagram .............................................................................................................................20 Operation of the DDR SDRAM ....................................................................................................................21 Timing Waveforms.......................................................................................................................................39 Package Drawing ........................................................................................................................................45 Recommended Soldering Conditions..........................................................................................................46
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Data Sheet E0563E10 (Ver. 1.0)
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EDD5116ADTA-5CLI-E
Electrical Specifications
* All voltages are referenced to VSS (GND). * After power up, wait more than 200 s and then, execute power on sequence and CBR (Auto) refresh before proper device operation is achieved. Absolute Maximum Ratings
Parameter Voltage on any pin relative to VSS Supply voltage relative to VSS Short circuit output current Power dissipation Operating ambient temperature Storage temperature Symbol VT VDD IOS PD TA Tstg Rating -1.0 to +3.6 -1.0 to +3.6 50 1.0 -40 to +85 -55 to +125 Unit V V mA W C C Note
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Parameter Supply voltage Input reference voltage Termination voltage Input high voltage Input low voltage Input voltage level, CK and /CK inputs Input differential cross point voltage, CK and /CK inputs Input differential voltage, CK and /CK inputs
Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions (TA = -40 to +85C)
Symbol min. 2.5 0 0.49 x VDDQ VREF - 0.04 VREF + 0.15 typ. 2.6 0 0.50 x VDDQ VREF -- max. 2.7 0 0.51 x VDDQ VREF + 0.04 VDDQ + 0.3 VREF - 0.15 VDDQ + 0.3 Unit V V V V V V V 2 3 4 Notes 1
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VDD, VDDQ VSS, VSSQ VREF VTT VIH (DC) VIL (DC) VIN (DC) VIX (DC) VID (DC)
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-0.3 -- -0.3 -- 0.5 x VDDQ - 0.2V 0.36 --
0.5 x VDDQ
0.5 x VDDQ + 0.2V V VDDQ + 0.6 V 5, 6
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Notes: 1. 2. 3. 4. 5. 6.
VDDQ must be lower than or equal to VDD. VIH is allowed to exceed VDD up to 3.6V for the period shorter than or equal to 5ns. VIL is allowed to outreach below VSS down to -1.0V for the period shorter than or equal to 5ns. VIN (DC) specifies the allowable DC execution of each differential input. VID (DC) specifies the input differential voltage required for switching. VIH (CK) min assumed over VREF + 0.18V, VIL (CK) max assumed under VREF - 0.18V if measurement.
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Data Sheet E0563E10 (Ver. 1.0)
EDD5116ADTA-5CLI-E
DC Characteristics 1 (TA = -40 to +85C, VDD, VDDQ = 2.6V 0.1V, VSS, VSSQ = 0V)
Parameter Operating current (ACT-PRE) Operating current (ACT-READ-PRE) Idle power down standby current Floating idle standby current Quiet idle standby current Active power down standby current Symbol IDD0 IDD1 IDD2P IDD2F IDD2Q IDD3P IDD3N IDD4R IDD4W IDD5 IDD6 IDD7A -5CLI Grade max. 160 220 3 35 20 30 70 310 310 330 3 550 Unit mA mA mA mA mA mA mA mA mA mA mA mA Test condition CKE VIH, tRC = tRC (min.) CKE VIH, BL = 4,CL = 3, tRC = tRC (min.) CKE VIL CKE VIH, /CS VIH DQ, DQS, DM = VREF CKE VIH, /CS VIH DQ, DQS, DM = VREF CKE VIL CKE VIH, /CS VIH tRAS = tRAS (max.) CKE VIH, BL = 2, CL = 3 CKE VIH, BL = 2,CL = 3 tRFC = tRFC (min.), Input VIL or VIH Input VDD - 0.2 V Input 0.2 V BL = 4 1, 5, 6, 7 Notes 1, 2, 9 1, 2, 5 4 4, 5 4, 10 3 3, 5, 6 1, 2, 5, 6 1, 2, 5, 6
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Active standby current Operating current (Burst read operation) Operating current (Burst write operation) Auto Refresh current Self refresh current (L-version) Operating current (4 banks interleaving) Parameter Input leakage current Output leakage current Output high current Output low current
Data Sheet E0563E10 (Ver. 1.0)
Notes: 1. These IDD data are measured under condition that DQ pins are not connected. 2. One bank operation. 3. One bank active. 4. All banks idle. 5. Command/Address transition once per one clock cycle. 6. DQ, DM and DQS transition twice per one clock cycle. 7. 4 banks active. Only one bank is running at tRC = tRC (min.) 8. The IDD data on this table are measured with regard to tCK = tCK (min.) in general. 9. Command/Address transition once every two clock cycle. 10. Command/Address stable at VIH or VIL. DC Characteristics 2 (TA = -40 to +85C, VDD, VDDQ = 2.6V 0.1V, VSS, VSSQ = 0V)
Symbol ILI ILO IOH IOL min. -2 -5 -15.2 15.2 max. 2 5 Unit
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A A -- mA -- mA
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Test condition
Notes
VDD VIN VSS
VDDQ VOUT VSS VOUT = 1.95V VOUT = 0.35V
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EDD5116ADTA-5CLI-E
Pin Capacitance (TA = +25C, VDD, VDDQ = 2.6V 0.1V)
Parameter Input capacitance Symbol CI1 CI2 Delta input capacitance Cdi1 Cdi2 Data input/output capacitance Delta input/output capacitance CI/O Cdio Pins CK, /CK All other input pins CK, /CK All other input-only pins DQ, DM, DQS DQ, DM, DQS min. 2.0 2.0 -- -- 4.0 -- typ. -- -- -- -- -- -- max. 3.0 3.0 0.25 0.5 5 0.5 Unit pF pF pF pF pF pF Notes 1 1 1 1 1, 2 1
Notes: 1. These parameters are measured on conditions: TA = +25C. 2. DOUT circuits are disabled.
f = 100MHz, VOUT = VDDQ/2, VOUT = 0.2V,
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Parameter Clock cycle time CK high-level width CK low-level width CK half period DQ output access time from CK, /CK DQS to DQ skew Data hold skew factor Read preamble Read postamble DQ and DM input setup time DQ and DM input hold time Write preamble setup time Write preamble Write postamble DQS input high pulse width DQS input low pulse width
Data Sheet E0563E10 (Ver. 1.0)
AC Characteristics (TA = -40 to +85C, VDD, VDDQ = 2.6V 0.1V, VSS, VSSQ = 0V)
-5C Symbol tCK tCH tCL tHP tAC tDQSCK tDQSQ tQH tQHS tHZ min. 5 0.45 0.45 min (tCH, tCL) -0.7 -0.6 -- tHP - tQHS -- max. 8 0.55 0.55 -- 0.7 0.6 0.4 -- 0.5 0.7 0.7 1.1 0.6 -- Unit ns tCK tCK tCK ns ns ns ns ns ns ns tCK tCK ns ns ns ns tCK tCK tCK tCK 9 8 8 7 5, 11 6, 11 2, 11 2, 11 3 Notes 10
DQS output access time from CK, /CK
DQ/DQS output hold time from DQS
Data-out high-impedance time from CK, /CK Data-out low-impedance time from CK, /CK
DQ and DM input pulse width
Write command to first DQS latching transition DQS falling edge to CK setup time DQS falling edge hold time from CK
Address and control input setup time Address and control input hold time Address and control input pulse width Mode register set command cycle time Active to Precharge command period
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-- tLZ -0.7 0.9 tRPRE tRPST tDS 0.4 0.4 tDH tDIPW 0.4 1.75 tWPRES tWPRE tWPST tDQSS tDSS tDSH tDQSH tDQSL tIS tIH tIPW tMRD tRAS 0 0.25 0.4 0.72 0.2 0.2 0.35 0.35 0.6 0.6 2.2 2 40
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-- -- -- -- 0.6 1.28 -- -- -- -- -- -- -- -- 70000
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tCK tCK tCK ns 8 ns 8 ns 7 tCK ns
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EDD5116ADTA-5CLI-E
-5C Parameter Active to Active/Auto refresh command period Symbol tRC min. 60 70 18 18 tRCD min. 10 15 (tWR/tCK)+ (tRP/tCK) 2 -- max. -- -- -- -- -- -- -- -- -- 7.8 Unit ns ns ns ns ns ns ns tCK tCK s 13 Notes
Auto refresh to Active/Auto refresh command period tRFC Active to Read/Write delay Precharge to active command period Active to Autoprecharge delay Active to active command period Write recovery time Auto precharge write recovery and precharge time Internal write to Read command delay Average periodic refresh interval tRCD tRP tRAP tRRD tWR tDAL tWTR tREF
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Data Sheet E0563E10 (Ver. 1.0)
Notes: 1. On all AC measurements, we assume the test conditions shown in the next page. For timing parameter definitions, see `Timing Waveforms' section. 2. This parameter defines the signal transition delay from the cross point of CK and /CK. The signal transition is defined to occur when the signal level crossing VTT. 3. The timing reference level is VTT. 4. Output valid window is defined to be the period between two successive transition of data out or DQS (read) signals. The signal transition is defined to occur when the signal level crossing VTT. 5. tHZ is defined as DOUT transition delay from Low-Z to High-Z at the end of read burst operation. The timing reference is cross point of CK and /CK. This parameter is not referred to a specific DOUT voltage level, but specify when the device output stops driving. 6. tLZ is defined as DOUT transition delay from High-Z to Low-Z at the beginning of read operation. This parameter is not referred to a specific DOUT voltage level, but specify when the device output begins driving. 7. Input valid windows is defined to be the period between two successive transition of data input or DQS (write) signals. The signal transition is defined to occur when the signal level crossing VREF. 8. The timing reference level is VREF. 9. The transition from Low-Z to High-Z is defined to occur when the device output stops driving. A specific reference voltage to judge this transition is not given. 10. tCK (max.) is determined by the lock range of the DLL. Beyond this lock range, the DLL operation is not assured. 11. tCK = tCK (min) when these parameters are measured. Otherwise, absolute minimum values of these values are 10% of tCK. 12. VDD is assumed to be 2.6V 0.1V. VDD power supply variation per cycle expected to be less than 0.4V/400 cycle. 13. tDAL = (tWR/tCK)+(tRP/tCK) For each of the terms above, if not already an integer, round to the next highest integer. Example: For -5C Speed at CL = 3, tCK = 5ns, tWR = 15ns and tRP= 18ns, tDAL = (15ns/5ns) + (18ns/5ns) = (3) + (4) tDAL = 7 clocks
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EDD5116ADTA-5CLI-E
Test Conditions
Parameter Input reference voltage Termination voltage Input high voltage Input low voltage Input differential voltage, CK and /CK inputs Input differential cross point voltage, CK and /CK inputs Input signal slew rate Symbol VREF VTT VIH (AC) VIL (AC) VID (AC) VIX (AC) SLEW Value VDDQ/2 VREF VREF + 0.31 VREF - 0.31 0.62 VREF 1 Unit V V V V V V V/ns
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Data Sheet E0563E10 (Ver. 1.0)
tCK
VDD
CK VID /CK
tCL tCH VIX
VREF
VSS
VDD VIH VIL
t
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DQ
VREF VSS
SLEW = (VIH (AC) - VIL (AC))/t
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VTT
Measurement point
RT = 50
Input Waveforms and Output Load
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CL = 30pF
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EDD5116ADTA-5CLI-E
Timing Parameter Measured in Clock Cycle
Number of clock cycle tCK Parameter Write to pre-charge command delay (same bank) Read to pre-charge command delay (same bank) Write to read command delay (to input all data) Burst stop command to write command delay Burst stop command to DQ High-Z Read command to write command delay (to output all data) Pre-charge command to High-Z Write command to data in latency Write recovery Symbol tWPD tRPD tWRD tBSTW tBSTZ tRWD tHZP tWCD tWR tDMD tMRD tSNR tSRD tPDEN tPDEX 5ns min. 4 + BL/2 BL/2 2 + BL/2 3 3 3 + BL/2 3 1 3 0 2 15 200 1 1 max. -- -- -- -- 3 -- 3 1 -- 0 -- -- -- 1 -- Unit tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK
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DM to data in latency Power down entry
Data Sheet E0563E10 (Ver. 1.0)
Mode register set command cycle time Self refresh exit to non-read command Self refresh exit to read command
Power down exit to command input
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EDD5116ADTA-5CLI-E
Block Diagram
CK /CK CKE
Clock generator
Bank 3 Bank 2 Bank 1
A0 to A12, BA0, BA1
Mode register
Row address buffer and refresh counter
Row decoder
Memory cell array Bank 0
Command decoder
/CS /RAS /CAS /WE
Control logic
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Data Sheet E0563E10 (Ver. 1.0)
Sense amp.
Column address buffer and burst counter
Column decoder
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Data control circuit
Latch circuit
DQS
Pr
CK, /CK
DLL
Input & Output buffer
DM
DQ
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EDD5116ADTA-5CLI-E
Pin Function
CK, /CK (input pins) The CK and the /CK are the master clock inputs. All inputs except DM, DQS and DQs are referred to the cross point of the CK rising edge and the /CK falling edge. When a read operation, DQS and DQs are referred to the cross point of the CK and the /CK. When a write operation, DQS and DQs are referred to the cross point of the DQS and the VREF level. DQS for write operation is referred to the cross point of the CK and the /CK. CK is the master clock input to this pin. The other input signals are referred at CK rising edge. /CS (input pin) When /CS is Low, commands and data can be input. When /CS is High, all inputs are ignored. However, internal operations (bank active, burst operations, etc.) are held. /RAS, /CAS, and /WE (input pins) These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels. See "Command operation". A0 to A12 (input pins) Row address (AX0 to AX12) is determined by the A0 to the A12 level at the cross point of the CK rising edge and the /CK falling edge in a bank active command cycle. Column address (See "Address Pins Table") is loaded via the A0 to the A9, and A11 at the cross point of the CK rising edge and the /CK falling edge in a read or a write command cycle. This column address becomes the starting address of a burst operation. [Address Pins Table]
Part number EDD5116AD
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Bank 0 Bank 1 Bank 2 Bank 3
Data Sheet E0563E10 (Ver. 1.0)
A10 (AP) (input pin) A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If A10 = High when a precharge command is issued, all banks are precharged. If A10 = Low when a precharge command is issued, only the bank that is selected by BA1/BA0 is precharged. If A10 = High when read or write command, auto-precharge function is enabled. While A10 = Low, auto-precharge function is disabled. BA0 and BA1 (input pins) BA0, BA1 are bank select signals (BA). The memory array is divided into bank 0, bank 1, bank 2 and bank 3. (See Bank Select Signal Table)
[Bank Select Signal Table]
BA0 L H L H
Remark: H: VIH. L: VIL.
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Address (A0 to A12) Row address Column address AY0 to AY9
AX0 to AX12
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11
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BA1 L L H H
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EDD5116ADTA-5CLI-E
CKE (input pin) This pin determines whether or not the next CK is valid. If CKE is High, the next CK rising edge is valid. If CKE is Low. CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the CKE is driven Low and exited when it resumes to High. CKE must be maintained high throughout read or write access. The CKE level must be kept for 1 CK cycle at least, that is, if CKE changes at the cross point of the CK rising edge and the /CK falling edge with proper setup time tIS, by the next CK rising edge CKE level must be kept with proper hold time tIH. LDM and UDM (input pins) DMs are the reference signal of the data input mask function. DMs are sampled at the cross point of DQS and VREF. DMs provide the byte mask function. When DM = High, the data input at the same timing are masked while the internal burst counter will be count up. In x16 products, LDM controls the lower byte (DQ0 to DQ7) and UDM controls the upper byte (DQ8 to DQ15) of write data.
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Data Sheet E0563E10 (Ver. 1.0)
DQ0 to DQ15 (input/output pins) Data is input to and output from these pins. LDQS and UDQS (input and output pins) DQS provides the read data strobes (as output) and the write data strobes (as input). In x16 products, LDQS is the lower byte (DQ0 to DQ7) data strobe signal, UDQS is the upper byte (DQ8 to DQ15) data strobe signal. VDD, VSS, VDDQ, VSSQ (Power supply) VDD and VSS are power supply pins for internal circuits. VDDQ and VSSQ are power supply pins for the output buffers.
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EDD5116ADTA-5CLI-E
Command Operation
Command Truth Table DDR SDRAM recognize the following commands specified by the /CS, /RAS, /CAS, /WE and address pins. All other combinations than those in the table below are illegal.
CKE Command Ignore command No operation Burst stop in read command Column address and read command Read with auto-precharge Symbol DESL NOP BST READ READA WRIT WRITA ACT PRE PALL REF SELF MRS EMRS n-1 H H H H H H H H H H H H H H n H H H H H H H H H H H L H H /CS H L L L L L L L L L L L L L /RAS /CAS /WE x H H H H H H L L L L L L L x H H L L L L H H H L L L L x H L H H L L H L L H H L L BA1 x x x V V V V V V x x x L L BA0 x x x V V V V V V x x x L H AP x x x L H L H V L H x x L L Address x x x V V V V V x x x x V V
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Write with auto-precharge Precharge select bank Precharge all bank Refresh Mode register set
Data Sheet E0563E10 (Ver. 1.0)
Column address and write command
Row address strobe and bank active
Remark: H: VIH. L: VIL. x: VIH or VIL V: Valid address input Note: The CKE level must be kept for 1 CK cycle at least. Ignore command [DESL] When /CS is High at the cross point of the CK rising edge and the VREF level, every input are neglected and internal status is held. No operation [NOP] As long as this command is input at the cross point of the CK rising edge and the VREF level, address and data input are neglected and internal status is held. Burst stop in read operation [BST] This command stops a burst read operation, which is not applicable for a burst write operation. Column address strobe and read command [READ] This command starts a read operation. The start address of the burst read is determined by the column address (See "Address Pins Table" in Pin Function) and the bank select address. After the completion of the read operation, the output buffer becomes High-Z. Read with auto-precharge [READA] This command starts a read operation. After completion of the read operation, precharge is automatically executed. Column address strobe and write command [WRIT] This command starts a write operation. The start address of the burst write is determined by the column address (See "Address Pins Table" in Pin Function) and the bank select address. Write with auto-precharge [WRITA] This command starts a write operation. After completion of the write operation, precharge is automatically executed.
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EDD5116ADTA-5CLI-E
Row address strobe and bank activate [ACT] This command activates the bank that is selected by BA0, BA1 and determines the row address (AX0 to AX12). (See Bank Select Signal Table) Precharge selected bank [PRE] This command starts precharge operation for the bank selected by BA0, BA1. (See Bank Select Signal Table) [Bank Select Signal Table]
BA0 Bank 0 Bank 1 Bank 2 Bank 3 L H L H BA1 L L H H
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CKE Truth Table
Current state Idle Idle Idle Self refresh Power down
Data Sheet E0563E10 (Ver. 1.0)
Remark: H: VIH. L: VIL. Precharge all banks [PALL] This command starts a precharge operation for all banks. Refresh [REF/SELF] This command starts a refresh operation. There are two types of refresh operation, one is auto-refresh, and another is self-refresh. For details, refer to the CKE truth table section. Mode register set/Extended mode register set [MRS/EMRS] The DDR SDRAM has the two mode registers, the mode register and the extended mode register, to defines how it works. The both mode registers are set through the address pins (the A0 to the A12, BA0 to BA1) in the mode register set cycle. For details, refer to "Mode register and extended mode register set".
Remark: H: VIH. L: VIL. x: VIH or VIL. Notes: 1. All the banks must be in IDLE before executing this command. 2. The CKE level must be kept for 1 CK cycle at least.
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Command Self-refresh entry (SELF) Self refresh exit (SELFX) Power down exit (PDEX)
Auto-refresh command (REF)
Power down entry (PDEN)
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CKE n-1 n /CS H H L L H L H L L H L L H H L L L H H H L L H H
/RAS L L H x x x
/CAS L L H x x x
/WE H H H x x x
Address x x x x x x x x
Notes 2 2
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H H H H
H
H
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EDD5116ADTA-5CLI-E
Function Truth Table The following tables show the operations that are performed when each command is issued in each state of the DDR SDRAM.
Current state Precharging*
1
/CS H L L L L L L
/RAS /CAS /WE x H H H H L L x H H L L H H L x H H L L H H x H L H L H L x x H L H L H L
Address x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x MODE x x x x x x
Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL
Operation NOP NOP ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* NOP ILLEGAL
11 11 11 11
Next state ldle ldle -- -- -- -- ldle -- ldle ldle
11 11 11
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L Idle*
2
L
H L
x H H
DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST
NOP NOP ILLEGAL* ILLEGAL* ILLEGAL* Activating NOP Refresh/ 12 Self refresh* Mode register set* NOP NOP ILLEGAL ILLEGAL ILLEGAL NOP NOP
11 11 11 11 11 12
H
L
-- -- -- Active ldle ldle/ Self refresh ldle ldle ldle -- -- -- Active Active -- -- -- -- -- -- Active
L
L
H L
L
L
L L L L L H L L L L Refresh 3 (auto-refresh)* H L L L L Activating*
4
x H H H L x H H H H L L L x H H H H L L L
x H
x H L x
H L x x
Pr
x x x x DESL H L H L H L x x H L H L H L x NOP BST BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x READ/READA WRIT/WRITA ACT PRE, PALL DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL
H L L L L L L L
H
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ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL NOP NOP ILLEGAL ILLEGAL*
11
H L L H H L x H H L L H H L
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Active*
5
H L L L L L L L
Active
Active
Starting read operation Read/READA Write Starting write operation recovering/ precharging -- Idle --
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Pre-charge ILLEGAL
Data Sheet E0563E10 (Ver. 1.0)
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EDD5116ADTA-5CLI-E
Current state Read*
6
/CS H L L L L L L L
/RAS /CAS /WE x H H H H L L L x x H H L L H H L x H H L L H H L x H L H L H L x x H L H L H L x
Address x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x x x x
Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL
Operation NOP NOP BST Interrupting burst read operation to start new read ILLEGAL* ILLEGAL*
13 11
Next state Active Active Active Active -- -- Precharging -- Precharging Precharging --
14 14 11, 14 11, 14
Interrupting burst read operation to start pre-charge ILLEGAL
EO
Read with auto-preH 7 charge* L L L L L L L Write*
8
DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL
NOP NOP ILLEGAL ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL
H H H
-- -- -- -- -- Write recovering Write recovering -- Read/ReadA
H L
L L
Write recovering*
9
Data Sheet E0563E10 (Ver. 1.0)
L
H L x x x H H H L H L L H H H L L L L L H L L L L L L L H L L L x H H H H L L L L L H H L x x H L H L H L x H L x H H L L H H L
DESL NOP BST READ/READA
NOP NOP ILLEGAL Interrupting burst write operation to start read operation. Interrupting burst write operation to start new write operation. ILLEGAL*
11
Pr
BA, CA, A10 BA, CA, A10 BA, RA ACT BA, A10 x x x x PRE, PALL DESL NOP BST BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x ACT PRE/PALL
WRIT/WRITA
Write/WriteA -- Idle -- Active Active --
od
ILLEGAL NOP NOP ILLEGAL READ/READA WRIT/WRITA ILLEGAL*
11 11
Interrupting write operation to start precharge.
uc
Starting read operation. Read/ReadA Starting new write operation. Write/WriteA -- -- ILLEGAL* ILLEGAL --
t
16
EDD5116ADTA-5CLI-E
Current state Write with auto10 pre-charge*
/CS H L L L L L L L
/RAS x H H H H L L L
/CAS x H H L L H H L
/WE x H L H L H L x
Address x x x BA, CA, A10 BA, CA, A10 BA, RA BA, A10 x
Command DESL NOP BST READ/READA WRIT/WRIT A ACT PRE, PALL
Operation NOP NOP ILLEGAL ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL
14 14 11, 14 11, 14
Next state Precharging Precharging -- -- -- -- -- --
Remark: Notes: 1. 2. 3. 4. 5. 6.
H: VIH. L: VIL. x: VIH or VIL The DDR SDRAM is in "Precharging" state for tRP after precharge command is issued. The DDR SDRAM reaches "IDLE" state tRP after precharge command is issued. The DDR SDRAM is in "Refresh" state for tRFC after auto-refresh command is issued. The DDR SDRAM is in "Activating" state for tRCD after ACT command is issued. The DDR SDRAM is in "Active" state after "Activating" is completed. The DDR SDRAM is in "READ" state until burst data have been output and DQ output circuits are turned off. 7. The DDR SDRAM is in "READ with auto-precharge" from READA command until burst data has been output and DQ output circuits are turned off. 8. The DDR SDRAM is in "WRITE" state from WRIT command to the last burst data are input. 9. The DDR SDRAM is in "Write recovering" for tWR after the last data are input. 10. The DDR SDRAM is in "Write with auto-precharge" until tWR after the last data has been input. 11. This command may be issued for other banks, depending on the state of the banks. 12. All banks must be in "IDLE". 13. Before executing a write command to stop the preceding burst read operation, BST command must be issued. 14. The DDR SDRAM supports the concurrent auto-precharge feature, a read with auto-precharge enabled,or a write with auto-precharge enabled, may be followed by any column command to other banks, as long as that command does not interrupt the read or write data transfer, and all other related limitations apply. (E.g. Conflict between READ data and WRITE data must be avoided.) The minimum delay from a read or write command with auto precharge enabled, to a command to a different bank, is summarized below.
EO
From command Read w/AP Write w/AP
Data Sheet E0563E10 (Ver. 1.0)
L
Read or Read w/AP Write or Write w/AP Read or Read w/AP Write or Write w/AP
To command (different bank, noninterrupting command)
Precharge or Activate
Precharge or Activate
Pr
BL/2 1 BL/2 1
od
Minimum delay (Concurrent AP supported) CL(rounded up)+ (BL/2) 1 + (BL/2) + tWTR
Units tCK tCK tCK tCK
uc
tCK tCK
t
17
EDD5116ADTA-5CLI-E
Command Truth Table for CKE
Current State CKE n-1 n Self refresh H L L L L L Self refresh recovery H H H H x H H H H L H H H H L L L L x H H /CS x H L L L x H L L L H L L L x H L x /RAS /CAS /WE Address x x H H L x x H H L x H H L x x H x x x x H L x x x H L x x H L x x x H x x x H L x x x x x x x x x x x x x x x x x H x x x x H L x x x x x Maintain power down mode Refer to operations in Function Truth Table Refer to operations in Function Truth Table Refer to operations in Function Truth Table x x x x x x x x x x x x x x Operation INVALID, CK (n-1) would exit self refresh Self refresh recovery Self refresh recovery ILLEGAL ILLEGAL Maintain self refresh Idle after tRC Idle after tRC ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL INVALID, CK (n - 1) would exit power down EXIT power down Idle Notes
EO
H H H H Power down H L L L All banks idle H H H H H H H H H H L Row active H L
Data Sheet E0563E10 (Ver. 1.0)
Remark: H: VIH. L: VIL. x: VIH or VIL Note: Self refresh can be entered only from the all banks idle state. Power down can be entered only from all banks idle or row active state.
L
L H H L L H H H H L L L L L x x x H L L L x L L H L H L L L L x x x L L x x x
Pr
L x x H x L L x x x H L x x x x x x x
CBR (auto) refresh
OPCODE Refer to operations in Function Truth Table Refer to operations in Function Truth Table
Refer to operations in Function Truth Table
Refer to operations in Function Truth Table Self refresh 1
od
Power down Power down
OPCODE Refer to operations in Function Truth Table 1
Refer to operations in Function Truth Table 1
uc t
18
EDD5116ADTA-5CLI-E
Auto-refresh command [REF] This command executes auto-refresh. The banks and the ROW addresses to be refreshed are internally determined by the internal refresh controller. The average refresh cycle is 7.8 s. The output buffer becomes High-Z after autorefresh start. Precharge has been completed automatically after the auto-refresh. The ACT or MRS command can be issued tRFC after the last auto-refresh command. Self-refresh entry [SELF] This command starts self-refresh. The self-refresh operation continues as long as CKE is held Low. During the selfrefresh operation, all ROW addresses are repeated refreshing by the internal refresh controller. A self-refresh is terminated by a self-refresh exit command. Power down mode entry [PDEN] tPDEN (= 1 cycle) after the cycle when [PDEN] is issued. The DDR SDRAM enters into power-down mode. In power down mode, power consumption is suppressed by deactivating the input initial circuit. Power down mode continues while CKE is held Low. No internal refresh operation occurs during the power down mode. [PDEN] do not disable DLL. Self-refresh exit [SELFX] This command is executed to exit from self-refresh mode. To issue non-read commands, tSNR has to be satisfied. ((tSNR =)15 cycles for tCK = 5.0 ns after [SELFX]) To issue read command, tSRD has to be satisfied to adjust DOUT timing by DLL. (200 cycles after [SELFX]) After the exit, input auto-refresh command within 7.8 s.
EO
Data Sheet E0563E10 (Ver. 1.0)
Power down exit [PDEX] The DDR SDRAM can exit from power down mode tPDEX (1 cycle min.) after the cycle when [PDEX] is issued.
L
Pr od uc t
19
EDD5116ADTA-5CLI-E
Simplified State Diagram
SELF REFRESH
SR ENTRY SR EXIT
MODE REGISTER SET
MRS
REFRESH
IDLE
*1 AUTO REFRESH
CKE CKE_
EO
POWER APPLIED
ACTIVE POWER DOWN
ACTIVE CKE_ CKE
IDLE POWER DOWN
ROW ACTIVE
BST READ
WRITE
Write
WRITE WITH AP
WRITE
READ WITH AP
READ
Read
READ READ WITH AP
Note: 1. After the auto-refresh operation, precharge operation is performed automatically and enter the IDLE state.
Data Sheet E0563E10 (Ver. 1.0)
L
WRITE WITH AP
READ WITH AP
PRECHARGE
WRITEA
READA
PRECHARGE PRECHARGE
POWER ON
Automatic transition after completion of command. Transition resulting from command input.
Pr
PRECHARGE
PRECHARGE
od
20
uc t
EDD5116ADTA-5CLI-E
Operation of the DDR SDRAM
Power-up Sequence (1) Apply power and maintain CKE at an LVCMOS low state (all other inputs are undefined). Apply VDD before or at the same time as VDDQ. Apply VDDQ before or at the same time as VTT and VREF. (2) Start clock and maintain stable condition for a minimum of 200 s. (3) After the minimum 200 s of stable power and clock (CK, /CK), apply NOP and take CKE high. (4) Issue precharge all command for the device. (5) Issue EMRS to enable DLL. (6) Issue a mode register set command (MRS) for "DLL reset" with bit A8 set to high (An additional 200 cycles of clock input is required to lock the DLL after every DLL reset). (7) Issue precharge all command for the device. (8) Issue 2 or more auto-refresh commands. (9) Issue a mode register set command to initialize device operation with bit A8 set to low in order to avoid resetting the DLL.
(4) (5) (6) (7) (8) (9)
EO
/CK CK
Command
PALL
EMRS
MRS
PALL
REF REF
tRP
tRFC
REF tRFC
MRS
Any command
Mode Register and Extended Mode Register Set
There are two mode registers, the mode register and the extended mode register so as to define the operating mode. Parameters are set to both through the A0 to the A12 and BA0, BA1 pins by the mode register set command [MRS] or the extended mode register set command [EMRS]. The mode register and the extended mode register are set by inputting signal via the A0 to the A12 and BA0, BA1 during mode register set cycles. BA0 and BA1 determine which one of the mode register or the extended mode register are set. Prior to a read or a write operation, the mode register must be set. Remind that no other parameters shown in the table bellow are allowed to input to the registers.
L
2 cycles (min.)
DLL enable
2 cycles (min.) 2 cycles (min.)
DLL reset with A8 = High
2 cycles (min.)
Disable DLL reset with A8 = Low
200 cycles (min)
BA0 0
BA1 0
A12
A11 A10 A9
Pr
A8 DR A7 0 A6 A5 0 0 LMODE
Power-up Sequence after CKE Goes High
od
A4 A3 A2 BT
A1 BL
A0
0
0
uc
A2 A1 A0 0 0 0 0 1 1 Burst Length BT=0 BT=1 2 2 1 4 4 0 1 8 8
MRS
A8 DLL Reset A6 A5 A4 CAS Latency 3 011 0 No 1 Yes
A3 Burst Type 0 Sequential 1 Interleave
t
Mode Register Set [MRS] (BA0 = 0, BA1 = 0)
Data Sheet E0563E10 (Ver. 1.0)
21
EDD5116ADTA-5CLI-E
BA0 BA1 1 0 A12 A11 A10 A9
A8 0
A7 0
A6 0
A5 0
A4 0
A3 0
A2 0
A1 DS
A0 DLL
0
0
0
0
EMRS A1 Driver Strength 0 Normal 1 Weak
A0 DLL Control 0 DLL Enable 1 DLL Disable
Extended Mode Register Set [EMRS] (BA0 = 1, BA1 = 0) Burst Operation The burst type (BT) and the first three bits of the column address determine the order of a data out.
Burst length = 2 A0 0 1 Sequence 0, 1, 1, 0, Interleave 0, 1, 1, 0, Burst length = 4 Starting Ad. Addressing(decimal) A1 0 0 1 1 Addressing(decimal) Interleave 0, 1, 2, 3, 4, 5, 6, 7, 1, 0, 3, 2, 5, 4, 7, 6, 2, 3, 0, 1, 6, 7, 4, 5, 3, 2, 1, 0, 7, 6, 5, 4, 0, 1, 2, 3, 4, 5, 6, 7, 1, 2, 3, 4, 5, 6, 7, 0, 2, 3, 4, 5, 6, 7, 0, 1, 3, 4, 5, 6, 7, 0, 1, 2, A0 0 1 0 1 Sequence 0, 1, 2, 3, 1, 2, 3, 0, 2, 3, 0, 1, 3, 0, 1, 2, Interleave 0, 1, 2, 3, 1, 0, 3, 2, 2, 3, 0, 1, 3, 2, 1, 0,
EO
A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1
Data Sheet E0563E10 (Ver. 1.0)
Starting Ad. Addressing(decimal)
Burst length = 8 Starting Ad.
L
0 1 0 1 0 1 0 1
A0 Sequence
Pr
4, 5, 6, 7, 0, 1, 2, 3, 5, 6, 7, 0, 1, 2, 3, 4, 6, 7, 0, 1, 2, 3, 4, 5, 7, 0, 1, 2, 3, 4, 5, 6,
4, 5, 6, 7, 0, 1, 2, 3, 5, 4, 7, 6, 1, 0, 3, 2, 6, 7, 4, 5, 2, 3, 0, 1, 7, 6, 5, 4, 3, 2, 1, 0,
od uc t
22
EDD5116ADTA-5CLI-E
Read/Write Operations Bank active A read or a write operation begins with the bank active command [ACT]. The bank active command determines a bank address and a row address. For the bank and the row, a read or a write command can be issued tRCD after the ACT is issued. Read operation The burst length (BL), the /CAS latency (CL) and the burst type (BT) of the mode register are referred when a read command is issued. The burst length (BL) determines the length of a sequential output data by the read command that can be set to 2, 4, or 8. The starting address of the burst read is defined by the column address, the bank select address which are loaded via the A0 to A12 and BA0, BA1 pins in the cycle when the read command is issued. The data output timing are characterized by CL and tAC. The read burst start CL * tCK + tAC (ns) after the clock rising edge where the read command are latched. The DDR SDRAM output the data strobe through DQS simultaneously with data. tRPRE prior to the first rising edge of the data strobe, the DQS are driven Low from VTT level. This low period of DQS is referred as read preamble. The burst data are output coincidentally at both the rising and falling edge of the data strobe. The DQ pins become High-Z in the next cycle after the burst read operation completed. tRPST from the last falling edge of the data strobe, the DQS pins become High-Z. This low period of DQS is referred as read postamble.
t0 t1 t5 t6 t7 t8 t9 t10
t11
EO
CK /CK Command
NOP
tRCD
NOP READ NOP
L
ACT
Row
Address
Column
tRPRE
BL = 2 DQS DQ
BL = 4
BL = 8
Pr
Read Operation (Burst Length)
out0 out1
tRPST
out0 out1 out2 out3
od
23
out0 out1 out2 out3 out4 out5 out6 out7
CL = 3 BL: Burst length
uc t
Data Sheet E0563E10 (Ver. 1.0)
;;;; ;
EDD5116ADTA-5CLI-E
t4 t4.5 t5 t5.5 t0 t0.5 t1 t1.5 t2 t2.5 t3 t3.5 CK /CK Command READ NOP tRPRE tRPST DQS VTT CL = 3 tAC,tDQSCK DQ out0 out1 out2 out3 VTT
Read Operation (/CAS Latency)
EO
t0 CK /CK Command
NOP
Write operation The burst length (BL) and the burst type (BT) of the mode register are referred when a write command is issued. The burst length (BL) determines the length of a sequential data input by the write command that can be set to 2, 4, or 8. The latency from write command to data input is fixed to 1. The starting address of the burst read is defined by the column address, the bank select address which are loaded via the A0 to A12, BA0 to BA1 pins in the cycle when the write command is issued. DQS should be input as the strobe for the input-data and DM as well during burst operation. tWPRE prior to the first rising edge of the DQS should be set to Low and tWPST after the last falling edge of the data strobe can be set to High-Z. The leading low period of DQS is referred as write preamble. The last low period of DQS is referred as write postamble.
L
t1
tRCD
tn tn+0.5 tn+1
tn+2
tn+3
tn+4
tn+5
Pr
NOP WRITE
Column
ACT
NOP
Address
Row
tWPRE
tWPRES
BL = 2
in0
in1
od
tWPST
DQS DQ
BL = 4
in0
in1
in2
in3
uc
in5 in6 in7
BL = 8
in0
in1
in2
in3
in4
BL: Burst length
Write Operation
t
Data Sheet E0563E10 (Ver. 1.0)
24
EDD5116ADTA-5CLI-E
Burst Stop Burst stop command during burst read The burst stop (BST) command is used to stop data output during a burst read. The BST command stops the burst read and sets the output buffer to High-Z. tBSTZ (= CL) cycles after a BST command issued, the DQ pins become High-Z. The BST command is not supported for the burst write operation. Note that bank address is not referred when this command is executed.
t0 CK /CK t0.5 t1 t1.5 t2 t2.5 t3 t3.5 t4 t4.5 t5 t5.5
Command
READ
BST tBSTZ
NOP 3 cycles
EO
DQS CL = 3 DQ
Data Sheet E0563E10 (Ver. 1.0)
out0
out1
CL: /CAS latency
Burst Stop during a Read Operation
L
Pr od uc t
25
EDD5116ADTA-5CLI-E
Auto Precharge Read with auto-precharge The precharge is automatically performed after completing a read operation. The precharge starts tRPD (BL/2) cycle after READA command input. tRAP specification for READA allows a read command with auto precharge to be issued to a bank that has been activated (opened) but has not yet satisfied the tRAS (min) specification. A column command to the other active bank can be issued the next cycle after the last data output. Read with auto-precharge command does not limit row commands execution for other bank. Refer to `Function truth table and related note(Notes.*14)`.
CK /CK
tRAP (min) = tRCD (min)
tRPD 2 cycles (= BL/2)
tRP (min)
EO
Command
ACT DQS
READA
NOP
ACT
tAC,tDQSCK
DQ
out0
out1
out2
out3
Note: Internal auto-precharge starts at the timing indicated by "
Write with auto-precharge The precharge is automatically performed after completing a burst write operation. The precharge operation is started (BL/ 2 + 4) cycles after WRITA command issued. A column command to the other banks can be issued the next cycle after the internal precharge command issued. Write with auto-precharge command does not limit row commands execution for other bank. Refer to the `Read with Auto-Precharge Enabled, Write with Auto-Precharge Enabled' section. Refer to `Function truth table and related note(Notes.*14)`.
L
tRCD (min)
ACT
NOP
".
Read with auto-precharge
Pr
tRAS (min)
WRITA
NOP
od
BL/2 + 4 cycles
CK /CK
tRP
ACT
Command
uc t
BL = 4
DM
DQS
DQ
in1
in2
in3
".
in4
Note: Internal auto-precharge starts at the timing indicated by "
Burst Write (BL = 4)
Data Sheet E0563E10 (Ver. 1.0)
26
EDD5116ADTA-5CLI-E
Command Intervals A Read command to the consecutive Read command Interval
Destination row of the consecutive read command Bank address 1. Same Row address State Same ACTIVE Operation The consecutive read can be performed after an interval of no less than 1 cycle to interrupt the preceding read operation. Precharge the bank to interrupt the preceding read operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive read command can be issued. See `A read command to the consecutive precharge interval' section. The consecutive read can be performed after an interval of no less than 1 cycle to interrupt the preceding read operation. Precharge the bank without interrupting the preceding read operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive read command can be issued.
2.
Same
Different
--
3.
Different
Any
ACTIVE IDLE
EO
t0 CK /CK Command
ACT
t4
t5
t6
t7
t8
t9
t10
t11
NOP
READ
READ
NOP
L
Row
Address BA
Column A Column B
Pr
Column = A Column = B Read Read
DQ
out out A0 A1
out B0
out B1
out B2
out B3
Column = A Dout
Column = B Dout
od
27
DQS
Bank0 Active
CL = 3 BL = 4 Bank0
READ to READ Command Interval (same ROW address in the same bank)
uc t
Data Sheet E0563E10 (Ver. 1.0)
EDD5116ADTA-5CLI-E
t0 CK /CK Command
ACT Row0 NOP ACT Row1 NOP READ READ NOP
t1
t2
t5
t6
t7
t8
t9
t10
t11
Address BA
Column A Column B
DQ
Column = A Column = B Read Read
out out A0 A1
Bank0 Dout
out out out out B0 B1 B2 B3
Bank3 Dout
EO
DQS
Bank0 Active
Data Sheet E0563E10 (Ver. 1.0)
Bank3 Active
Bank0 Read
Bank3 Read
CL = 3 BL = 4
READ to READ Command Interval (different bank)
L Pr od uc t
28
A Write command to the consecutive Write command Interval
Destination row of the consecutive write command Bank address 1. Same Row address State Same
2.
Same
3.
Different
CK
/CK
Command
Address BA
DQ
DQS
Data Sheet E0563E10 (Ver. 1.0)
;;;;;
EDD5116ADTA-5CLI-E
Operation ACTIVE Different -- Any ACTIVE IDLE The consecutive write can be performed after an interval of no less than 1 cycle to interrupt the preceding write operation. Precharge the bank to interrupt the preceding write operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued. See `A write command to the consecutive precharge interval' section. The consecutive write can be performed after an interval of no less than 1 cycle to interrupt the preceding write operation. Precharge the bank without interrupting the preceding write operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued.
t0 tn tn+1 tn+2 tn+3 tn+4 tn+5 tn+6
ACT Row NOP WRIT WRIT
EO
Bank0 Active
NOP
Column A Column B
L
inA0 inA1 inB0 inB1 inB2 inB3
Column = B Write
WRITE to WRITE Command Interval (same ROW address in the same bank)
Pr
Column = A Write
BL = 4 Bank0
od
29
uc
t
CK /CK Command
Address BA
DQ
DQS
;;;; ;;
EDD5116ADTA-5CLI-E
tn+3 tn+4 tn+5 t0 t1 t2 tn tn+1 tn+2
ACT NOP ACT NOP
WRIT
WRIT
NOP
Row0
Row1
Column A Column B
inA0 inA1 inB0 inB1 inB2 inB3
Bank0 Write Bank3 Write
EO
Bank0 Active
Data Sheet E0563E10 (Ver. 1.0)
Bank3 Active
BL = 4 Bank0, 3
WRITE to WRITE Command Interval (different bank)
L
Pr
30
od
uc
t
EDD5116ADTA-5CLI-E
A Read command to the consecutive Write command interval with the BST command
Destination row of the consecutive write command Bank address 1. Same Row address State Same ACTIVE Operation Issue the BST command. tBSTW ( tBSTZ) after the BST command, the consecutive write command can be issued. Precharge the bank to interrupt the preceding read operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued. See `A read command to the consecutive precharge interval' section. Issue the BST command. tBSTW ( tBSTZ) after the BST command, the consecutive write command can be issued. Precharge the bank independently of the preceding read operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued.
2.
Same
Different
--
3.
Different
Any
ACTIVE IDLE
EO
t0 CK /CK Command
READ
t1
t2
t3
t4
t5
t6
t7
t8
BST
NOP tBSTW ( tBSTZ)
WRIT
NOP
L
High-Z
DM
tBSTZ (= CL)
Pr
out0 out1
OUTPUT
DQ
in0
in1
in2
in3
DQS
READ to WRITE Command Interval
od
INPUT
BL = 4 CL = 3
uc t
Data Sheet E0563E10 (Ver. 1.0)
31
A Write command to the consecutive Read command interval: To complete the burst operation
Destination row of the consecutive read command Row address State Same
1.
2.
3.
Command
Data Sheet E0563E10 (Ver. 1.0)
;;;;;;
EDD5116ADTA-5CLI-E
Bank address Same Operation ACTIVE Same Different -- Different Any ACTIVE IDLE To complete the burst operation, the consecutive read command should be performed tWRD (= BL/ 2 + 2) after the write command. Precharge the bank tWPD after the preceding write command. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive read command can be issued. See `A read command to the consecutive precharge interval' section. To complete a burst operation, the consecutive read command should be performed tWRD (= BL/ 2 + 2) after the write command. Precharge the bank independently of the preceding write operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive read command can be issued.
t0 t1 t2 t3 t4 t5 t6 t7 t8 CK /CK
WRIT NOP READ NOP
EO
DM DQ
DQS
Note: tWTR is referenced from the first positive CK edge after the last desired data in pair tWTR.
L
in0 in1
INPUT
tWRD (min)
BL/2 + 2 cycle
tWTR*
Pr
in2 in3
out0
out1
out2
OUTPUT
WRITE to READ Command Interval
od
32
BL = 4
CL = 3
uc
t
EDD5116ADTA-5CLI-E
A Write command to the consecutive Read command interval: To interrupt the write operation
Destination row of the consecutive read command Bank address 1. 2. 3. Same Same Different Row address State Same Different Any ACTIVE -- ACTIVE IDLE Operation DM must be input 1 cycle prior to the read command input to prevent from being written invalid data. In case, the read command is input in the next cycle of the write command, DM is not necessary. --*
1
DM must be input 1 cycle prior to the read command input to prevent from being written invalid data. In case, the read command is input in the next cycle of the write command, DM is not necessary. --*
1
Note: 1. Precharge must be preceded to read command. Therefore read command can not interrupt the write operation in this case.
EO
t0 CK /CK Command
WRIT
WRITE to READ Command Interval (Same bank, same ROW address)
t1 t2 t3 t4 t5 t6 t7 t8
L
READ 1 cycle
NOP CL=3
DM
Pr
in1
in2
DQ
in0
out0 out1 out2 out3
High-Z High-Z
DQS
od
33
Data masked
BL = 4 CL = 3
[WRITE to READ delay = 1 clock cycle]
uc t
Data Sheet E0563E10 (Ver. 1.0)
Command
Command
Data Sheet E0563E10 (Ver. 1.0)
;;;;;
EDD5116ADTA-5CLI-E
t6 t7 t8 t0 t1 t2 t3 t4 t5 CK /CK WRIT NOP READ NOP 2 cycle CL=3 DM DQ in0 in1 in2 in3 out0 out1 out2 out3 High-Z DQS High-Z Data masked BL = 4 CL = 3
EO
t0 CK /CK
WRIT
[WRITE to READ delay = 2 clock cycle]
L
t1
NOP
t2
t3
t4
t5
t6
t7
t8
Pr
READ 3 cycle CL=3 tWTR*
NOP
DM
od
34
DQ
in0
in1
in2
in3
out0 out1 out2 out3
DQS
Data masked
BL = 4 CL = 3
Note: tWTR is referenced from the first positive CK edge after the last desired data in pair tWTR.
[WRITE to READ delay = 3 clock cycle]
uc
t
EDD5116ADTA-5CLI-E
A Read command to the consecutive Precharge command interval (same bank): To output all data To complete a burst read operation and get a burst length of data, the consecutive precharge command must be issued tRPD (= BL/ 2 cycles) after the read command is issued.
t0 CK /CK Command
NOP
READ
t1
t2
t3
t4
t5
t6
t7
t8
NOP
PRE/ PALL
NOP
DQ
out0 out1 out2 out3
DQS
EO
t0 CK /CK Command DQ DQS
Data Sheet E0563E10 (Ver. 1.0)
tRPD = BL/2
READ to PRECHARGE Command Interval (same bank): To output all data (CL = 3, BL = 4)
READ to PRECHARGE Command Interval (same bank): To stop output data A burst data output can be interrupted with a precharge command. All DQ pins and DQS pins become High-Z tHZP (= CL) after the precharge command.
t1 t2 t3 t4 t5 t6 t7 t8
READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 3, BL = 2, 4, 8)
L
NOP
READ
PRE/PALL CL = 3
NOP
High-Z
out0 out1
Pr
tHZP
High-Z
od uc t
35
A Write command to the consecutive Precharge command interval (same bank) The minimum interval tWPD is necessary between the write command and the precharge command.
t0 t1 t2 t3 t4 t5 t6
CK /CK Command
DM
DQS
DQ
Precharge Termination in Write Cycles During a burst write cycle without auto precharge, the burst write operation is terminated by a precharge command of the same bank. In order to write the last input data, tWR (min) must be satisfied. When the precharge command is issued, the invalid data must be masked by DM.
CK /CK
Command
DM
DQS
DQ
Data Sheet E0563E10 (Ver. 1.0)
;;;;;;; ;; ;
EDD5116ADTA-5CLI-E
t7
WRIT NOP PRE/PALL NOP
tWPD
tWR
EO
t0
WRIT
in0
in1
in2
in3
Last data input
WRITE to PRECHARGE Command Interval (same bank) (BL = 4)
L
t1 in0 in1
Precharge Termination in Write Cycles (same bank) (BL = 4)
Pr
t2 t3 t4
NOP tWR
t5
t6
t7
PRE/PALL
NOP
od
36
uc
in2
in3
Data masked
t
EDD5116ADTA-5CLI-E
Bank active command interval
Destination row of the consecutive ACT command Bank address 1. 2. Same Different Row address Any Any State ACTIVE ACTIVE IDLE Operation Two successive ACT commands can be issued at tRC interval. In between two successive ACT operations, precharge command should be executed. Precharge the bank. tRP after the precharge command, the consecutive ACT command can be issued. tRRD after an ACT command, the next ACT command can be issued.
CK /CK
EO
Command
ACTV ACT
ACT
NOP
PRE
NOP
ACT
NOP
Address
ROW: 0
ROW: 1
ROW: 0
BA
Bank0 Active
tRRD
Bank3 Active
Bank0 Precharge
Bank0 Active
Mode register set to Bank-active command interval The interval between setting the mode register and executing a bank-active command must be no less than tMRD.
CK /CK Command
Data Sheet E0563E10 (Ver. 1.0)
L
MRS Address
CODE
tRC
Bank Active to Bank Active
Mode Register Set
Pr
NOP tMRD
ACT
NOP
od
BS and ROW
Bank3 Active
uc t
37
EDD5116ADTA-5CLI-E
DM Control DM can mask input data. In x16 products, UDM and LDM can mask the upper and lower byte of input data respectively. By setting DM to Low, data can be written. When DM is set to High, the corresponding data is not written, and the previous data is held. The latency between DM input and enabling/disabling mask function is 0.
t1 t2 t3 t4 t5 t6
DQS
DQ
Mask
Mask
EO
DM
Data Sheet E0563E10 (Ver. 1.0)
Write mask latency = 0
DM Control
L Pr od uc t
38
Timing Waveforms
Command and Addresses Input Timing Definition
CK /CK
Read Timing Definition
/CK CK
DQS
DQ (Dout)
Write Timing Definition
/CK CK
DQS
DQ (Din)
DM
Data Sheet E0563E10 (Ver. 1.0)
;;;;;;
EDD5116ADTA-5CLI-E
tIS
tIH
Command (/RAS, /CAS, /WE, /CS)
VREF
tIS
tIH
Address
VREF
EO
tCK
tCH
tCL
tDQSCK
tDQSCK
tDQSCK
tDQSCK tRPST
tRPRE
tDQSQ
tLZ
tAC
tQH tAC
tDQSQ
tAC
tQH tHZ
L
tCK
tQH
tDQSQ tQH
tDQSQ
Pr
tDSS
tDQSL
tDQSS
tDSH
tDSS
VREF
tWPRES
tWPRE
tDQSH
tWPST
od
tDIPW
tDIPW
tDIPW
VREF
tDS
tDH
VREF
tDS
tDH
uc
t
39
EDD5116ADTA-5CLI-E
Read Cycle
tCK tCH tCL
; ;; ; ;; ; ;;
CK /CK
VIH tRC
CKE
tRCD
tRAS
tRP
tIS tIH
tIS tIH
tIS tIH
tIS tIH
/CS
tIS tIH
tIS tIH
tIS tIH
tIS tIH
/RAS
; ;; ;; ; ;
A10
EO
tIS tIH
/CAS
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
/WE
tIS tIH
tIS tIH
tIS tIH
tIS tIH
BA
tIS tIH
tIS tIH
tIS tIH
tIS tIH
L
tIS tIH
High-Z High-Z
tIS tIH
tIS tIH
Address
Pr
tRPRE
DM
tRPST
DQS
DQ (output)
od
Bank 0 Precharge
Bank 0 Active
Bank 0 Read
CL = 2 BL = 4 Bank0 Access = VIH or VIL
uc
t
Data Sheet E0563E10 (Ver. 1.0)
40
;;; ;; ; ; ;
EDD5116ADTA-5CLI-E
Write Cycle
tCK tCH tCL CK /CK VIH tRC CKE tRAS tRCD tRP tIS tIH tIS tIH tIS tIH tIS tIH /CS tIS tIH tIS tIH tIS tIH tIS tIH /RAS
EO
tIS tIH /CAS tIS tIH /WE tIS tIH BA tIS tIH A10 tIS tIH Address DQS (input) DM DQ (input) Bank 0 Active
Data Sheet E0563E10 (Ver. 1.0)
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
tIS tIH
L
tIS tIH Bank 0 Write
tIS tIH
tDQSS
tDQSL
tWPST
Pr
tDQSH tDS tDS
tDH
tDS
tDH
od
tWR
tDH
Bank 0 Precharge
CL = 2 BL = 4 Bank0 Access = VIH or VIL
uc
t
41
EDD5116ADTA-5CLI-E
Mode Register Set Cycle
0
/CK CK CKE /CS /RAS /CAS /WE
VIH
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
EO
BA Address
valid
code
code
R: b
C: b
DM
High-Z High-Z
DQS
DQ (output)
b
tRP
tMRD
Read/Write Cycle
/CK CK CKE /CS /RAS /CAS /WE BA Address
DM
VIH
L
Precharge If needed
R:a C:a
High-Z Bank 0 Active
Mode register set
Bank 3 Active
Bank 3 Read
Bank 3 Precharge
CL = 2 BL = 4 = VIH or VIL
Pr od
C:b
a
R:b
C:b''
DQS DQ (output) DQ (input)
tRWD Bank 0 Bank 3 Read Active Bank 3 Write
b
uc
b''
tWRD
Bank 3 Read Read cycle CL = 2 BL = 4 =VIH or VIL
t
Data Sheet E0563E10 (Ver. 1.0)
42
EDD5116ADTA-5CLI-E
Auto Refresh Cycle
/CK CK CKE /CS /RAS /CAS /WE VIH
EO
BA Address DM DQS DQ (output) DQ (input)
Data Sheet E0563E10 (Ver. 1.0)
A10=1
R: b
C: b
b High-Z tRFC Bank 0 Active Bank 0 Read CL = 2 BL = 4 = VIH or VIL tRP
L
Precharge If needed
Auto Refresh
Pr od
43
uc t
EDD5116ADTA-5CLI-E
Self Refresh Cycle
/CK CK CKE
tIS
tIH CKE = low
/CS /RAS
/CAS
/WE
EO
BA Address A10=1 DM
R: b
C: b
L
tRP Precharge If needed Self refresh entry
DQS DQ (output) DQ (input)
High-Z tSNR tSRD Bank 0 Active Bank 0 Read CL = 2.5 BL = 4 = VIH or VIL
Pr
Self refresh exit
od uc t
Data Sheet E0563E10 (Ver. 1.0)
44
EDD5116ADTA-5CLI-E
Package Drawing
66-pin Plastic TSOP (II) Solder plating: Lead free (Sn-Bi)
Unit: mm
22.22 0.10 *1
A
66
34
PIN#1 ID
1
0.65
33
B
0.17 to 0.32
0.13 M S A B
11.76 0.20
10.16
1.0 0.05
1.20 max
0.09 to 0.20
S
0.10 S
0.10 +0.08 -0.05
EO
Data Sheet E0563E10 (Ver. 1.0)
0.80 Nom
0.91 max.
0.25
0 to 8
Note: This dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.20mm per side. ECA-TS2-0029-01
L
0.60 0.15
Pr
45
od uc t
EDD5116ADTA-5CLI-E
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the EDD5116ADTA. Type of Surface Mount Device EDD5116ADTA: 66-pin Plastic TSOP (II) < Lead free (Sn-Bi) >
EO
Data Sheet E0563E10 (Ver. 1.0)
L Pr od uc t
46
EDD5116ADTA-5CLI-E
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR MOS DEVICES
Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it.
HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
EO
2 3
Data Sheet E0563E10 (Ver. 1.0)
No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications.
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function.
L
Pr
47
CME0107
od uc t
EDD5116ADTA-5CLI-E
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] This product is not designed to be resistant to electromagnetic waves or radiation. This product must be used in a non-condensing environment. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations.
EO
Data Sheet E0563E10 (Ver. 1.0)
L
Pr
48
M01E0107
od uc t

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